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  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • Prototron Names Thoroughman to Oregon Regional Sales

Prototron Names Thoroughman to Oregon Regional Sales

Published: 14 January 2009
 by Staff
REDMOND, WA – Prototron Circuits has appointed William Thoroughman to manage sales in Oregon. He has held key sales positions throughout his career. Prior to joining Prototron, he was the major account manager at Foxconn.
 
“Oregon is an extremely important region for Prototron, and we looked long and hard to get the best person possible to handle it for us,” said Russ Adams, West Coast regional sales manager.
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  • The Dynamics of PCB Trace Heating and Cooling, and a Call to Action
  • What is the Best Material for a High-Speed PCB?
  • Characterizing Etchback and Dielectric Loss Tangent
  • Sequential Lamination in PCB Manufacturing
  • Are You Using Too Many Vias?

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