TAIWAN - While a weakening consumer electronics market caused company revenue to fall by 31% in February, Nan Ya PCB has reportedly been moving toward diversifying its businesses to manage capital during the market slowdown.

In the fourth quarter of last year, the company’s flip chip substrates were certified by Intel’s 45nm manufacturing process, and industry reports indicate that the company has begun small shipments of the product to Intel. As production volume and sales grow, it is said that the product’s higher gross profit is expected to help boost company revenue.

The company is also reportedly planning to expand its HDI capacity by 100,000 square feet, and thin board capacity to over 150,000 square feet, at its plant in Kunshan, China.

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