MANFREDONIA, IT - SOMACIS PCB reports that it will begin production of technically sophisticated PCBs in a new plant within the first half of the year.

The company reports that they will produce samples and a small series of Chip Scale Packages that will have the track and isolation starting at 25µm, and use HDI (high density interconnects) and buried passive components.  Construction of the boards will use SBU technology, sequential lamination, a coreless semi-additive process, and highly defined circuitry through the use of the LDI process.    
 
“The constant growth in the process of miniaturization in electronic products and components plays an important part in the exciting field in which Somacis PCB industries operates. Keeping up with electronic evolution and the ever-changing market needs is our firm intention,” stated Pierluigi Volpi, R&D Technical Director. “We are ready to launch ourselves into these new technological challenges, backed-up by the amount of experience and know-how that we have amassed over the years.”
 
The company's laboratory in Castelfidardo has been previously recognized by the Italian Ministry of Education, University and Research, and the Nadcap Accreditation for Electronics in the aerospace sector. “We took the decision to further expand our productive activities in this part of Italy. We firmly believe in this project, and we are investing considerable resources for the benefit of all the Somacis group,...creating stable, qualified employment in an area that seriously needs it”.

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