YOKOHAMA, JAPAN – MKS Instruments unveiled a significant investment in its Yokohama Technical Center in Japan that will enable an integrated approach to creating solutions for complex package substrate manufacturing, satisfying current requirements as well as those needed for future roadmaps.

The recent investment in the YTC delivers the latest capabilities for the production of next-generation package substrates. The YTC utilizes dedicated lasers, optics, and motion systems for high-precision, high-speed via formation in ABF build-up laminates, in combination with the latest process chemistry and equipment for desmear and electroless copper metallization. Using the latest Equalized Curtain Flow (ECF) plating tool, the YTC is able to support customers in their yield optimization and next generation process development for advanced packaging applications.

During a ceremony to celebrate the YTC expansion, Dr. John T.C. Lee, president and CEO of MKS Instruments, escorted visitors around the facility to showcase the two new systems that have been installed in the center, the ESI Geode A CO2 laser system and the Atotech G-Plate plating tool, as well as demonstrating the Vitrocoat process for Plating on Glass (PoG).

We are highly committed to driving and leading technology development within our industries,” Lee said. “With these key installations, we are accelerating time to market through our combined capabilities, which allow us to view problems holistically and design solutions faster. This helps us to drive innovation for next generation electronic devices and offer customers and OEMs quicker development cycles for new products and materials enabling high-end SAP technology requiring <=5/5µm lines and spaces. Our unique portfolio of MKS combined services at our Yokohama technical center allows us to reduce the cycle time for a typical ABF sample from three months or more to less than one month.”

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