TAOYUAN CITY, TAIWAN – The Taiwan Printed Circuit Association initiated the research of a new roadmap for PCB smart manufacturing in Taiwan.

With regard to the smart manufacturing implementation process and in consideration of the future challenges for the PCB industry, the TCPA, the Institute for Information Industry and the Taiwan Institute of Economic Research have updated the “Roadmap of Smart Manufacturing Development for Taiwan’s PCB Industry.”

This new roadmap plans the different processes for the development and application of smart manufacturing in the PCB industry. At the application levels, the framework covers smart equipment, smart production and smart operations. It is divided into linkage (data capture and integration), visualization (data presentation), transparency (data simulation and analysis), prediction (data prediction), and adaptation (decision support and guidance).

The plan aims to achieve visualization of production lines for the short term, smart production for the medium term, and smart operations for the long term.

The Printed Circuit Board Equipment Communication Interface established in collaboration with SEMI is the foundation for PCB smart manufacturing; it will help resolve various communication inconsistencies between PCB equipment and manufacture to accelerate the development of PCB smart manufacturing, TPCA says.

Register now for PCB East, the largest electronics technical conference and exhibition on the East Coast. Coming in April to Marlboro, MA.

• Prev
• Next