MORRISVILLE, NC – iNEMI is hosting a call-for-participation webinar on reliability and loss properties of copper foils for 5G applications on May 27 and 28.

The webinar will explain how a project team plans to characterize various copper surface treatments to mitigate signal loss, while still maintaining good adhesion and durability of a printed circuit board.

iNEMI will review the increasing requirements for smooth copper to minimize signal loss within PCB structures, and how this smooth copper can be a challenge to reliability. In addition, the team plans a comparative study to determine signal loss from copper roughening by the pre-bonding chemical treatment during PCB fabrication (oxide alternative process).

Ongoing developments in PCB material, fabrication and metrology will be described. The overall objective of the project will be to correlate surface finish to durability to signal loss to optimize the design and qualification of PCBs for future high-speed applications.

For more information and to register for session 1, visit https://community.inemi.org/ev_calendar_day.asp?date=5/27/2021&eventid=425.

For more information and to register for session 2, visit https://community.inemi.org/ev_calendar_day.asp?date=5/28/2021&eventid=426.

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