MIGDAL HA'EMEK, ISRAEL -- An inkjet-based conductive digital printer maker today announced it has successfully printed and tested a novel method for printing inside vias.

PV Nano Cell said it printed inside vias 0.6mm (0.024") in diameter and 1mm (0.04") high on an FR-4 substrate. The printed vias were measured at a minimal resistance of 0.1Ω.

One side of the substrate is printed a pattern consisting of multiple widths and thicknesses (heights) of conductive features. This pattern forms an accurate resistor that heats to high temperature in less than milliseconds.

The company said it could print smaller-sized vias as well.

“In this special application, we first print inside the via," explained Dr. Fernando de la Vega, chief executive, PV Nano Cell. "Then we print the first designated pattern on one side of the FR-4. The substrate is then flipped over and we print the second designated pattern on the other side of the FR-4. The via printed in the beginning of the process electrically connects between the two patterns printed on the two sides of the substrate.

"The unique printing process that we developed cuts approximately 50% of the cost of production compared to the existing manufacturing solution. We are positive we can improve the process even more and print smaller-sized via.”

Hanan Markovich, chief of business development, added, "The printed parts have gone through intensive, high-demanding standard testing by the customer and we expect the production to begin in the near future. Such an achievement demonstrates again, the feasibility and attractiveness of PV Nano Cell’s solutions for mass production applications. “

PV Nano Cell said the technologies allow customers to fully realize the potential of inkjet-based electronics printing for mass production applications. The company’s also makes silver-based conductive inks.

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