SAN DIEGO – CIRCUITS ASSEMBLY and PRINTED CIRCUIT DESIGN AND FAB announced the 2020 New Product Introduction Award winners for electronics assembly equipment, materials, software, and PCB fabrication.

The 13th annual NPI Awards recognize leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Air-Vac Engineering: Rework and Repair Tools (AVX250)
Anda Technologies: Cleaning Equipment (AP-3P)
Anda Technologies: Curing Ovens (VCO Series)
ASM Assembly Systems: Component Placement – Accessory Technologies (Siplace SmartFeeder AutoRefill)
Cogiscan: Software – Production (Quality Driver Software Suite)
CyberOptics: Software – Process Control (CyberCMM)
CyberOptics: Test & Inspection – SPI (SQ3000)
Data I/O: Device Programming (PSV2800)
Hanwha Techwin: Component Placement – High Speed (HM520)
Henkel: Thermal Interface Materials (Bergquist Gap Pad TGP 10000ULM)
Indium: Soldering Materials (Durafuse LT)
Inspire Solutions: Automation Tools (Toolmaker)
ITW EAE: Soldering – Wave (Electrovert DwellFlex 4.0)
Juki: Component Placement – Multi-Function (JM-100)
Kyzen: Cleaning Materials (Kyzen E5631)
Magnalytix: Process Control Tools (Magnalytix OE-250 SIR Testing)
Nihon Superior: Cored Wire (TipSave N)
Nordson Asymtek: Dispensing Equipment (Qadence)
Nordson Dage: First Article Inspection (Prospector)
Nordson Dage: Test & Inspection – AXI (Assure Stock Line)
Part Analytics: Software – Management (AI Driven Spend and RFQ     Management)
Promation: Soldering – Alternative (Panda)
Rehm Thermal Systems: Soldering – Reflow (Vision TripleX)
Rogers Corporation: Laminates (TC350 Plus)
Rohde & Schwarz: Test & Inspection – Functional Test (R&S NGM200)
Saki: Software – Production (Quality Driver Software Suite)
Viscom: Test & Inspection – AOI (3D AOI system S3088 DT)
VJ Electronix: Component Storage (XQuik III)
Weller Tools: Soldering – Hand Tools (Weller Active Tip Range)

The awards were presented during a ceremony at IPC Apex Expo in San Diego.

“The new products continue to impress,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY and PCD&F. “Judges were especially enthralled with equipment that gives manufacturers more in-house control over process consumables.”

About UP Media Group Inc.

UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FAB (pcdandf.com) and CIRCUITS ASSEMBLY (circuitsassembly.com), as well as the PCB UPdate (pcbupdate.com) e-newsletter. UPMG produces trade shows and conferences, including PCB West (pcbwest.com) and the PCB2Day workshops (pcb2day.com). UPMG also produces the PCB Chat podcast (upmg.podbean.com/).

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