ARLINGTON, VA -- US Defense Advanced Research Projects Agency (DARPA) has awarded contracts worth some $1.2 million to Raytheon and BAE Systems develop optical interconnects for next-generation multichip modules.
The program aims to develop components with significant improvements in speeds and power efficiency.
The contracts are part of the US government's Photonics in the Package for Extreme Scalability (PIPES) program. PIPES seeks to develop high-value MCMs (ASIC, FPGA, GPU, CPU, etc.) with in-package photonic I/O, yielding energy, density, and bandwidth greater than 10 times what is capable today. The program also seeks to develop scalable, manufacturable technologies with performance well beyond the current state of the art, with an emphasis on domestic capabilities for high-density, low-loss photonic and electronic packaging.