LISLE, IL – Molex has developed the capability to print high-performing silver flexible circuits on polyester substrates with traces as narrow as 0.13mm and spacing as small as 0.13mm.

The process creates an alternative to traditional flexible circuits, etched copper traces on polyimide, and printed circuit boards, the firm says.

“Designers must fit ever-smaller components and traces on limited real estate,” said Dan Dawiedczyk, director of marketing, Molex. “Polyimide can accommodate that need, but is more expensive than PET. As an alternative to copper circuits, Molex has the option to use new silver ink technology and advanced printing to screen extremely fine traces on PET in a wide variety of applications.”

The new technology allows the attachment of fine-pitch (0.5mm) IC-based components on PET via a bonding process using traditional SMT equipment. That process also enables attachment of right angle LEDs.

In the final step of the attachment process, a UV-cured encapsulant is used to protect the solder joints.

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