Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • The Trade Show Connection

    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

  • Understanding ANOVA

    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

  • High Yield Design Practices

    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

Homepage Slideshow

  • The Trade Show Connection

    Finding community amid chaos.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18980-on-flying-finding-and-the-trade-show-floor

  • Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18981-the-analysis-of-variance-drawing-conclusions-from-data-that-are-correct-unambiguous-and-defensible

  • High Yield Design Practices

    Building with manufacturing limits in mind.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18979-tried-and-true-design-practices-for-high-pcb-yield

  • Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.

    https://pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18976-why-rigid-flex-pcbs-are-an-untapped-design-solution

  • PCB Thermal Challenges

    When passive heat management isn’t enough.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

Tweets by @FrancesStewart5
Printed Circuit Design & Fab Magazine
  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • News
  • Fab News
  • Icape Group Acquires Minority Stake in Green PCB Developer

EIPC Issues Call for Papers for Summer Conference in Edinburgh

Published: 10 March 2016
 by Chelsey Drysdale

EDINBURGH, UK – EIPC is holding its summer conference June 9 and 10 here.

For information about submitting an abstract, including conference topics, visit http://files.ctctcdn.com/81bb99bd001/86b45841-9fe5-46c4-9d5d-cd7147d9c8a2.pdf.

To submit an abstract for consideration, complete this form: http://files.ctctcdn.com/81bb99bd001/63958882-bb85-4b2d-9591-2b92ec9a6bf3.pdf

Abstracts are due Mar. 25.

To register for the conference, visit http://files.ctctcdn.com/81bb99bd001/d559761d-7ba9-41dd-aa04-cb12fdef576e.pdf.

 

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
NOVEMBER ISSUE
November cover

View the Digital
Edition Here!

POPULAR

  • Elements of PCB Panelization
  • The Analysis of Variance: Drawing Conclusions from Data that are Correct, Unambiguous and Defensible
  • Tracking Giants: Inside the World’s Top PCB Fabricators
  • Component Dynamics: Where Market Intelligence Meets Distribution
  • Tried-and-True Design Practices for High PCB Yield

Press Releases

  • Photonics Systems Group Announces Exclusive After-Hours Tech Event at Productronica 2025
  • High Density Packaging User Group Announces European Space Agency Membership
  • High-Density Packaging User Group Announces ASKPCB Membership
  • NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2025 Printed Circuit Engineering Association®, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy