Printed Circuit Design & Fab Online Magazine - Design News

Design News

Details: Written by Staff; Category: Design News; Published: 11 July 2007

ATLANTA – Intercept Technology, provider of advanced PCB/Hybrid/RF electrical engineering tools, and SiSoft, provider of integrated signal integrity and timing solutions for high-speed digital system design, announced the integration of Intercept’s Pantheon with SiSoft’s Quantum-SI.

The integration of Pantheon and Quantum-SI software provides a tool set for advanced SI analysis coupled with PCB layout.

Intercept’s PCB/Hybrid/RF layout application, Pantheon, is available on Sun Solaris, Linux, and Windows platforms; SiSoft's Quantum-SI is available in multiple configurations.

Details: Written by Staff; Category: Design News; Published: 06 July 2007

NEEDHAM, MA — Parametric Tech said yesterday its third-quarter revenue would be roughly $225 million, well below its previous guidance of $235 million to $240 million.

Despite a 4% year-on-year increase in total revenue for the quarter, license revenue in North America and Japan is projected to be $62 million, far short of expectations, CEO and president C. Richard Harrison said.

The company has begun reducing costs, Harrison said.

The company also expects to lower fourth-quarter guidance.

In April 2004, Parametric acquired Ohio Design, known for its InterComm electronics design verification, visualization and collaboration software.

Details: Written by Staff; Category: Design News; Published: 06 July 2007

CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution.
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Details: Written by Staff; Category: Design News; Published: 03 July 2007

NEW YORK – Electronics materials maker Park, parent of Nelco, said net sales in the May quarter fell 9% year-over-year to $57.1 million. Earnings from operations fell $2.1 million, to $7.5 million for the period ended May 27. Net earnings dropped 16.9% to $7.4 million.

PITTSBURGH — ZTE Corp., China's largest publicy held telecommunications equipment OEM, has signed a deal to use Ansoft Corp.'s signal and power integrity analysis software for printed circuit boards.

The new design methodology permits ZTE to eliminate expensive build-test-repeat iterations in its design cycle, the company said in a statement.

"Our engineers are very experienced in PCB design and needed to expand capabilities for EMI/EMC. Previously, we were using expensive and time-consuming prototyping and testing to make sure the design performance met requirements," said Zhu Shunlin, chief engineer of the EDA group at ZTE. "Ansoft's design methodology and technical support team helped us solve this issue, improve product performance, reduce cost and speed our time to market."

DIJON, FRANCE -- Park Electrochemical Corp.'s electronic materials operation here is performing "very badly," company officials said last week.

In a conference call with analysts, chief executive Brian Shore cited the migration of electronics manufacturing to Asia as the cause, adding the company is considering all alternatives regarding the operation.