CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution. Read more ...
NEW YORK – Electronics materials maker Park, parent of Nelco, said net sales in the May quarter fell 9% year-over-year to $57.1 million. Earnings from operations fell $2.1 million, to $7.5 million for the period ended May 27. Net earnings dropped 16.9% to $7.4 million.
PITTSBURGH — ZTE Corp., China's largest publicy held telecommunications equipment OEM, has signed a deal to use Ansoft Corp.'s signal and power integrity analysis software for printed circuit boards.
The new design methodology permits ZTE to eliminate expensive build-test-repeat iterations in its design cycle, the company said in a statement.
"Our engineers are very experienced in PCB design and needed to expand capabilities for EMI/EMC. Previously, we were using expensive and time-consuming prototyping and testing to make sure the design performance met requirements," said Zhu Shunlin, chief engineer of the EDA group at ZTE. "Ansoft's design methodology and technical support team helped us solve this issue, improve product performance, reduce cost and speed our time to market."
DIJON, FRANCE -- Park Electrochemical Corp.'s electronic materials operation here is performing "very badly," company officials said last week.
In a conference call with analysts, chief executive Brian
Shore cited the migration of
electronics manufacturing to Asia as the cause, adding the company is considering all alternatives regarding the operation.