SAN JOSE, CA – The MicroElectronics Packaging and Test Engineering Council in February will sponsor a symposium on semiconductor packaging’s effect on consumer electronics.
The technical event will address packages for consumer products, with session topics including time-to-market and consumer semiconductor packaging; cost-of-ownership challenges for consumer products; solutions for consumer product miniaturization, and advancing technologies for consumer electronics.
It takes place Feb. 19 in San Jose. For more information, visit www.meptec.org.
MUNICH, GERMANY and WESTFORD, MA – Zuken is developing the Zuken PDM Adapter, a unified intercommunication bridge between CR-5000 and third-party PDM systems..
WYLIE, TX -- Global Innovation Corp announces fiscal Q1 2009 financial results. The company is a wholly owned subsidiary of Best Circuit Boards Inc. The company designs, engineers and manufactures PCBs.
Net sales increased to $9,367,803 for the three months ending October 31, 2008 up 11% compared to the same period in 2007. A one-time large order from a new customer is responsible for the increase.
Gross profit for the same period was $1,944,266, also up 11%. Gross margin remained consistent with 2007, at 21%. Net income for the quarter was $160,200.
THREE RIVER FALLS, MN – Digi-Key Corp. has been named Bourns Catalog Distributor of the Year for Europe. The award was announced during a presentation at electronica 2008, held in Munich in November. Despite the unstable global market, Digi-Key is experiencing growing sales in Europe. The award acknowledges the company’s ability to provide a comprehensive range of Bourns products, with specific focus on new products and technologies. “This award is fully deserved with Digi-Key’s expanding European business, customers and sales growth this year,” said Graham Maggs, Bourns’ director of distribution sales in Europe.
TAIPEI – At the recent Windows Hardware Engineering Conference (WinHEC) in Taipei, Huawei Technologies introduced a Windows 7 OS-enabled 3.5G mobile module. According to company representatives, Asustek Computer will use the mobile modules in its Eee PCs. Huawei believes the modules will eventually become a standard part of mobile Internet devices. The claim is based on a recent IDC report in which global netbook shipments are projected to increase to 20.8 million units in 2009.
WILLSONVILLE, OR and IASI, ROMANIA – Mentor Graphics has extended its university program to the Gheorghe Asachi Technical University in Iasi. As part of the company’s Higher Education Program (HEP), Mentor is donating electronic design automation (EDA) software and support valued at more than $20 million. Students will graduate with extensive knowledge of methodologies for functional verification and field-programmable gate array (FGPA) design and analysis. In addition, semiconductor supplier Infineon Technologies will be equipping a new microelectronics development laboratory at the university. “Investment in the electronics industries of emerging regions depends on having highly talented engineers skilled in the latest and most relevant electronic design methodologies,” explains Ian Burgess, development manager for Mentor’s HEP.