Log in / Register
  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
      READ MORE...

  • American Standard Circuits’ Push for UHDI is On

    American Standard Circuits’ Push for UHDI is On

    After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
      READ MORE...

  • Collaborating Across the Industry

    Collaborating Across the Industry

    The High Density Packaging User Group drives innovation through active partnerships.
      READ MORE...

  • Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Why a relatively unknown technology might be right for static bend applications.
      READ MORE...

  • Embedded Sensors in Flex Circuits

    Embedded Sensors in Flex Circuits

    From glob top to lamination, solutions for sealing parts in flex.
      READ MORE...

Homepage Slideshow

Chip Design Swinging Back In-House, Cadence Says

Published: 28 February 2013
 by Staff

SAN JOSE -- The time to market for new chips might be holding steady, but who is designing them is in transition, a top Cadence executive says.

"IP is becoming increasingly important (and) it's growing much faster than the core EDA business," says Geoffrey Ribar, chief financial officer of the EDA software developer. "Approximately 30% of the (new) chips are custom-designed" today, he asserted today at the Morgan Stanley Media and Telecom Conference. "System companies ... (have) vertically integrated back into chip design," he added, replacing chips that they previously would have purchased outside.

"I only see that business continuing to grow going forward," he added.

This swing is taking place while the time to market for chips is staying relatively consistent at 18 to 24 months, Ribar said.

 

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article