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Webinar Explains Designing Away CAF

Published: 27 September 2012
 by Staff

COLLEGE PARK, MD -- DfR Solutions will present a webinar on preventing conductive anodic filament formation on Oct. 11.

CAF formation is a well-known mechanism involving migration of copper filaments within a printed circuit board under an applied bias. When the copper filaments bridge adjacent conductors, such as plated through-holes, they can cause loss of resistance, an electrical short, and even spectacular fireworks. While CAF is influenced by a number of parameters, one of the most effective deterrents to this mechanism is good design.

The webinar will cover CAF drivers and best practices for eliminating them. To register, click here.

 

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