Log in / Register
  • ENEPIG Corrosion Mechanisms

    ENEPIG Corrosion Mechanisms

    Different types of nickel corrosion and potential mitigation strategies.
      READ MORE...

  • The Future is Thin, Flat and Flexible

    The Future is Thin, Flat and Flexible

    What’s ahead for antennas, heaters and inks.
      READ MORE...

  • Royalty Flush

    Royalty Flush

    A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
      READ MORE...

  • Rocking and Rolling at ZIW

    Rocking and Rolling at ZIW

    The annual user event was tuned into AI, but that’s not the only melody being played.
      READ MORE...

  • Can Thailand Pad its PCB Gains?

    Can Thailand Pad its PCB Gains?

    2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
      READ MORE...

Homepage Slideshow

Data Transfer Spec Up for Review

Published: 15 July 2011
 by Staff

BANNOCKBURN, IL -- The latest draft of the IPC standard for electronics data transfer is available for industry review and comment.

IPC-2581A, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, is available at http://files.ipc.org/IPC-2581A_FD.zip. The file includes the standard, a comment form and schema.

IPC will accept comments through Aug. 4. The IPC task group charged with writing the standard will meet in mid-August to resolve any comments.

Several major CAD and CAM vendors, including Cadence, DownStream Technologies and Zuken, have indicated support of the pending standard.

IPC is also seeking companies to participate in the consensus ballot group to vote on IPC-2581A. Companies need not be members of IPC to participate.  Click here for details.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article