MAYNARD, MA – A paper written by Signal Integrity Software Inc. (SiSoft) and co-authored with Cisco Systems has been nominated as a Best Paper Finalist at DesignCon 2009. “A Simple Via Experiment” presents an analytical model for understanding and predicting behavior of via structures, correlated to lab measurements. Theoretical, 3D field solver and measured data will be presented for an experimental via structure designed so that the experiment can be easily repeated. Dr. Michael Steinberger of SiSoft will present the paper on February 3.