GELEEN, THE NETHERLANDS AND PEACHTREE CITY, GA – April 24, 2025 – The EIPC, European Institute for the PCB Community) and Printed Circuit Engineering Association (PCEA) will cohost a "Design to Fabrication" Technical Symposium this spring in several Northern European cities.

The new event is scheduled to take place on May 6, 7 and 9 in the following cities: Stockholm, Tallinn and Copenhagen.

The presentations include:

• Rick Hartley, RHartley Enterprises – Differential Pair Routing for SI and EMI Control
• Tarja Rapala, EIPC – HDI and Ultra HDI PCB Manufacturing and Design Considerations
• Alun Morgan, Ventec – PCB Materials: What Designers Need to Know
• Steven Driver, JIVA Materials – Design with the End in Mind

The symposium is designed for designers and other professionals involved in the electronics and fabrication industries. It will provide valuable insights, technical discussions, and networking opportunities for all attendees. Registration costs €75 each day and is open at eipc.org.

Ventec and JIVA Materials are corporate sponsors for the event.

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