New Products

SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool. 

Ansoft Corp., www.ansoft.com/siwave
The Niton XL3 Series third-generation handheld XRF analyzer is said to provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers. Typical time for routine solder screening measurements is said to be less than 5 sec. Features a 50 kV, 2W x-ray tube. Comes in a range of configurations with an assortment of optional features and accessories; quick screening to simultaneous measurement of up to 25 elements in a sample. Offers component testing; solder analysis; populated PCBs and finished goods; hi-reliability screening.

Thermo Fisher Scientific Inc., www.thermo.com/niton

The CM8 PWB cleaner has elastomer rollers said to remove contamination to 1µm and transfer dry, unattached particles from the substrate onto pre-sheeted adhesive rolls. An anti-static system prevents recontamination of the board. Has a direct motor drive mechanism said to eliminate the need for drive belts or chains. Cleans a range of substrates and board thicknesses.

Teknek Electronics Ltd.
, www.teknek.com

AVIA 355-14 is an intermediate power level model in a package optimized for micromachining at high throughput rates. Is an all-solid-state Q-switched laser said to generate more than 14W at 355 nm. Pulse duration is <30 ns and high beam quality is (M2 <1.3). Reportedly supports pulse repetition rates as high as 300 kHz. Long-lived pump diodes are field- replaceable. Frequency-tripling component has a projected lifetime of stable output power for more than 60,000 hrs. Includes Posilock beam position sensor and feedback system. Additional automation enhancements include total pulse control and a variety of pulse-shaping features. Applications include chip singulation, scribing and dicing of silicon and low-K materials, via drilling, and solar-cell micromachining.

Coherent Inc., www.coherent.com 
 eTEC thin film embedded thermoelectric cooler functions as miniature, solid-state heat pump; is ideal for cooling hot spots that result from localized areas of high heat flux on an IC. Operates by Peltier effect. Is designed with compound semiconductor materials that have high electrical conductivity and poor thermal conductivity. Adds 100 µm of height to a heat spreader. Has ms response time. Said to pump a max. heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2. Can operate in a high COP regime and pump a heat flux of 50 – 100 W/cm2.

Nextreme, www.nextreme.com  
Universal Contacts, for SMT, provide an electrical connection between a device and a PCB. Come as a single piece stamped product, incorporating pre-load and anti-lift features, designed to replace traditional interfaces requiring customized contacts. For use to connect a number of device components in any direction and configuration using the same interface, reducing qualification time. Come in heights of 1.3, 1.8, 2.5, 3.5 and 4 mm. So-called "solderwells" are said to prevent solder wicking up the contact. Are WEEE and RoHS compliant.

ITT Electronic Components, www.ittcannon.com 

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