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MacDermid Releases Additive Circuit Technology

Published: 16 January 2007
 
WATERBURY, CT – MacDermid Electronics Solutions has released MicroCat, a fully additive circuit formation process. MicroCat is the result of high-resolution catalytic imaging and high productivity additive metallization.
 
The two step MicroCat process results in solid copper circuit traces at a fraction of the cost of etched aluminum foil, etched copper foil, or silver PTF pastes and has demonstrated proven capability in RFID, smart card, membrane switch and various other additive circuit applications.
 
With its wide operating window, MicroCat can be used in either manual or automated process equipment and on various flexible and rigid substrates. All printing technologies are suited for MicroCat processing.
 
 
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