AgENIG (electroless nickel and immersion gold plating over thick film silver) substrates reportedly offer performance advantages when using Pb-free, higher temperature solder required for RoHS compliance.  Are said to eliminate solder leaching; enable processing up to 260°C or higher; permit multiple SMT reflow solder cycles, touchup and repairs. Are suitable for assembly types including SMT soldering and die attach. Addition of a thin layer of palladium plating permits gold wire bonding and eutectic die attach. Products can be used up to 170°C continuous operating temperature. Pattern definition can be held to 0.006" line and spaces.

Remtec, www.remtec.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article