Sarcon SPG-20A low-viscosity thermally conductive silicone compound is said to be an easy to dispense. Applied between a heat-generating component and nearby heat sink or spreader, fills all unwanted gaps up to 3.0 mm in height. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to + 150C). Provides thermal conductivity of 2.0W/m°K with a thermal resistance of 2.1°C cm2/W. Permits vibration absorption.
Fujipoly, www.fujipoly.com