BondFilm MS 500 is a super-concentrate that employs new additives. Has enhanced adhesion at standard etch depths; compatibility with a range of materials (high and low Tg, halogen-free). Offers good adhesion along copper loading curve in terms of initial peel strength. Great thermal reliability; acid resistance above five min.; copper loading window up to 28g/L.
Atotech, www.atotech.com