LCP Laminates are adhesiveless and film-based, for semiconductor packages and coreless designs up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Start with Rogers Ultralam 3000 materials, for low dielectric constant and dissipation factor for RF designs. Tolerate high levels of radiation exposure

Endicott Interconnect Technologies, www.eitny.com

 

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article