ENDICOTT, NY – Endicott Interconnect Technologies has released HPC-Z interconnections that provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
 
The HPC-Z interconnect reportedly solves thick board drilling and wire density problems with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary plated-through-hole (PTH) drilling.
 
“Now, you only laser drill the length of the sub-composite,” said Voya Markovich, CTO and senior vice president of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
 
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced; instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
 

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