BERLIN – Atotech’s Inpulse 2HF electrolyte coupled with the Uniplate InPulse 2 is said to be ideally suited for blind microvia filling. The process reportedly enables “super filling” which gives unrivalled productivity and blind microvia filling with half the copper plating thickness in comparison to standard processing.
 
According to the company, the product features savings in soldermask, etching chemistry and processing time, as well as 50% less Cu plating. Other reported benefits include minimal Cu plated on surface, high productivity, excellent surface uniformity, proven in HDI production, 2 mil line and space performance
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