The EI-1169 conductive ink is a UV-curable, polymer-free silver formulation designed for inkjet deposition in printed electronics, semiconductor packaging and additive manufacturing applications. Engineered for strong adhesion on copper, epoxy and polyimide substrates, the ink supports low-temperature processing and stable jetting performance across industry-standard printheads. The metal-organic decomposition (MOD) ink is lead-free and halogen-free and supports UV curing at 365nm and 395nm wavelengths. Combines long shelf stability, repeatable print performance and scalable processing for digitally manufactured electronics.

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