DuPont's Pyralux ML double-sided metal-clad laminates were developed for optimal thermal management for high-reliability markets such as aerospace, defense, electric vehicles, AI-related networking and other electronic devices.

Contain metal alloy, such as copper-nickel, featuring Kapton all-polyimide dielectric technology, and provide essential thermal resistance for heating, thermal conductivity to improve the desired heat transfer, resistivity for higher heat output, and thermoelectric properties as needed for the application. Are available in a variety of dielectric and foil types, thicknesses and a range of metal constructions, and are fully compatible with most conventional circuit fabrication processes.

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