IRVINE, CAHenkel Electronics has introduced the Accelerated Cooling (AC) process to be used in conjunction with Hysol FP5000 and Hysol FP5001, the company’s two flip-chip in package non-conductive paste (NCP) underfill encapsulants.
The patent-pending AC flip-chip assembly process heats the device while it is secured by the flip-chip bonder head and then is cooled during compression onto the NCP-coated substrate. This rapid cooling process enables assembly completion prior to any excess heat exposure, reducing package warpage and voids caused by moisture and assembly cycle time.
The AC process is reported to cut the typical cycle time by nearly 50%, delivering a 7 second cycle time. 
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