Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • The Trade Show Connection

    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

  • Understanding ANOVA

    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

  • High Yield Design Practices

    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

Homepage Slideshow

  • The Trade Show Connection

    Finding community amid chaos.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18980-on-flying-finding-and-the-trade-show-floor

  • Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18981-the-analysis-of-variance-drawing-conclusions-from-data-that-are-correct-unambiguous-and-defensible

  • High Yield Design Practices

    Building with manufacturing limits in mind.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18979-tried-and-true-design-practices-for-high-pcb-yield

  • Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.

    https://pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18976-why-rigid-flex-pcbs-are-an-untapped-design-solution

  • PCB Thermal Challenges

    When passive heat management isn’t enough.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

Tweets by @FrancesStewart5
Printed Circuit Design & Fab Magazine
  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • New Products
  • Tektronix Debuts TBS2000B Digital Storage Oscilloscopes

Rogers Adds 9µm Foil Option to RO3003G2 Laminates

Published: 31 May 2022

RO3003G2 laminates now include a 9µm electrodeposited HVLP foil option. Are for antenna outer layers for millimeter wave radar PCBs, for example.

Can reduce copper reduction steps needed to meet final PCB copper thickness requirements after filled via formation. Unbalanced cladding options allow thicker copper to remain on ground layer.

Rogers Corp.
rogerscorp.com

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
DECEMBER ISSUE
November cover

View the Digital
Edition Here!

POPULAR

  • Elements of PCB Panelization
  • Nexperia Crisis Exposes Hidden Fragility in the PCB Supply Chain
  • Tracking Giants: Inside the World’s Top PCB Fabricators
  • Tried-and-True Design Practices for High PCB Yield
  • On Flying, Finding and the Trade Show Floor

Press Releases

  • Schmid Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
  • Photonics Systems Group Announces Exclusive After-Hours Tech Event at Productronica 2025
  • High Density Packaging User Group Announces European Space Agency Membership
  • High-Density Packaging User Group Announces ASKPCB Membership
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2025 Printed Circuit Engineering Association®, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy