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Rogers Adds 9µm Foil Option to RO3003G2 Laminates

Published: 31 May 2022

RO3003G2 laminates now include a 9µm electrodeposited HVLP foil option. Are for antenna outer layers for millimeter wave radar PCBs, for example.

Can reduce copper reduction steps needed to meet final PCB copper thickness requirements after filled via formation. Unbalanced cladding options allow thicker copper to remain on ground layer.

Rogers Corp.
rogerscorp.com

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