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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • Rogers Adds 9µm Foil Option to RO3003G2 Laminates

Rogers Adds 9µm Foil Option to RO3003G2 Laminates

Published: 31 May 2022

RO3003G2 laminates now include a 9µm electrodeposited HVLP foil option. Are for antenna outer layers for millimeter wave radar PCBs, for example.

Can reduce copper reduction steps needed to meet final PCB copper thickness requirements after filled via formation. Unbalanced cladding options allow thicker copper to remain on ground layer.

Rogers Corp.
rogerscorp.com

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