Graphite embedding capability allows embedding of layers of synthetic graphite within RF and microwave printed circuit boards.
Allows efficient conduction of heat away from devices such as Gallium nitride (GaN) solid state power amplifiers (SSPAs). Method embeds thin layers of synthetic graphite inside structure of host PCB, reportedly increasing lifetime of active devices (MTBF) by permitting operation at cooler steady state.
Teledyne Labtech
teledynelabtech.com
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