CircuEtch 300 anisotropic final etch for circuit formation in semi-additive and modified-semi-additive processes (SAP/mSAP) is used in IC substrate and substrate-like HDI manufacturing.

Has wide operating window. Etch rate can be adjusted to meet specific process requirements for different types of substrates. Reduces surface roughness of pattern-plated electrolytic copper traces for improved electrical properties. Is non-flammable; reportedly eliminates flammable material shipping and storage concerns. Defines traces with optimal geometry, zero undercut and vertical trace sidewalls for excellent electrical performance. Bath has predictable etching rate over wide range of additive, copper, acid, chloride concentration and operating temp., while running in horizontal spray etching equipment.

CE 300

MacDermid Alpha Electronics Solutions
MacDermidAlpha.com

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