Onyx direct metallization system is for high-reliability and complex printed circuit boards.

Is used in horizontal conveyorized equipment or in vertical immersion mode. Can process array of resin materials, including PTFE, polyimide, BT, flex, and epoxy-based resin systems. Is alternative to electroless copper deposition. Reduces water consumption to 4-6 gal./min. Contains no chelator.

RBP Chemical Technology
rbpchemical.com

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