Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow

  • What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi

  • The Critical Nature of PCB Stackup

    The stackup supports every layer above it.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19042-the-critical-nature-of-pcb-stackup-and-how-to-build-an-efficient-one

  • The PCB Design Review Process

    A structured design review process ensures alignment.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19037-reviewing-the-pcb-design-review-process

  • Metal-Core PCBs and Thermal Management

    Catch heat at the board.

    https://pcdandf.com/pcdesign/index.php/current-issue/293-board-talk/19039-metal-core-pcbs-and-thermal-management

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • New Products
  • Zuken Releases CADSTAR 10.0

Polar Instruments Upgrades Si9000e PCB Field Solver

Published: 17 May 2019

Si9000e PCB field solver now comes with LA9000 S-parameter loss analysis options and new Monte Carlo analysis option.

Updates bi-directional copy/paste interface between Speedstack and Si9000e. Has improved support for loss tangent (Ref TanD). Causal modeling now extended to copper losses.

Polar Instruments

www.polarinstruments.com

 

Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center. pcbwest.com

 

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
MARCH ISSUE
February cover

View the Digital
Edition Here!

POPULAR

  • The Victory Plan Reborn: Forcing the Surge of America’s Drone Industrial Base
  • Experimental Evaluation of High-Thermal Dielectric Materials and Surface-Mount Thermal Bridges in Multilayer PCB Designs
  • The Critical Nature of PCB Stackup, and How to Build an Efficient One
  • Ultra HDI: What is It and How is It Different than HDI?
  • Adhesive vs. Adhesiveless Polyimide Core Materials Used in Flex and Rigid-Flex Applications

Press Releases

  • AdvancedPCB Strengthens HDI Process Control with New AOI Investment in Chandler, AZ Facility
  • Global Tablet Shipments Decline 3% QoQ in Q4 2025 as Market Matures
  • Schmid Group Secures Major Order for Wet-Process Production Equipment Supporting AI- and HPC-Infrastructure
  • AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy