Sherlock automated design analysis software v. 5.3 now features thermal-mechanical analysis, which provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

Uses a physics of failure approach to indicate when thermal temperatures are too hot for integrated circuits and solder joints. Is said to quickly and easily run thermal-mechanical analyses, eliminating data-entry. Provides more accurate thermal profiles of product designs early in product development. Improves designs by changing component type, material parameters, and or layout to minimize loads during thermal expansion. Other new features include:

• Increased Parts Library customizability for more efficient parts review
• Revised QFN solder fatigue model - incorporates the effect of mold compound CTE and glass transition temperature on fatigue life predictions
• New Help feature - searches through all of Sherlock’s user guides and educational materials
• New User tab - traceability for parts creation and modification
• Expanded part library capabilities - permits more flexibility during the export process
• Semiconductor Wearout analysis - incorporates part temperature rises
• GUI changes - improves the overall user-friendliness of Sherlock

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