TechniFlex LCL1000F/423M direct imaging fine-pitch matte black solder mask is for flexible applications.
Is suited for assembly conditions, including hot-bar soldering or multiple lead-free reflows. Reportedly shows no cracking after multiple 180° bends, even when processing 12µm polyimide substrate. Has less than 10µm of undercut. Provides high-resolution on 50µm solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. Is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll-to-roll coating operations.
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