127-31 one-component (100% solids) thermally conductive epoxy adhesive, encapsulant and potting compound is electrically insulating, with a thermal conductivity of 3.0 W/mK.
Features thermal stability up to 325°C and is chemical resistant. Absorbs stress when bonding mismatched CTE substrates with low-temperature curing, and offers a four-day pot life at room temperature. Has elastomeric properties. Is useful when applications call for silicone-free products. Typical applications include printed circuit board fabrication, power management, advanced materials composites, LED attachment, and heat sink bonding.
Creative Materials Inc.
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