127-31 one-component (100% solids) thermally conductive epoxy adhesive, encapsulant and potting compound is electrically insulating, with a thermal conductivity of 3.0 W/mK.

Features thermal stability up to 325°C and is chemical resistant. Absorbs stress when bonding mismatched CTE substrates with low-temperature curing, and offers a four-day pot life at room temperature. Has elastomeric properties. Is useful when applications call for silicone-free products. Typical applications include printed circuit board fabrication, power management, advanced materials composites, LED attachment, and heat sink bonding.

Creative Materials Inc.



Register now for PCB West the Silicon Valley's largest PCB industry trade show: pcbwest.com!

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article