Contac S4 enables through-hole plating on a laboratory scale, as a result of a cleaning step for microvias. Station can be equipped with up to six baths. Generates through-holes with aspect ratios of up to 1:10, even on multilayer boards with up to eight layers. Tolerance in layer buildup is +/- 2µm. Tin-plating step improves solderability.
LPKF, www.lpkf.com