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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Press Releases

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Category: Press Releases

Isola Group (www.isola-group.com), a global innovator in materials for printed-circuit boards (PCBs), will be showing a wide range of its wares at the upcoming Productronica 2021 exhibition. Scheduled for November 16-19, 2021, at the Messe Munchen (Munich, Germany), Productronica (www.productronica.com) is one of the world’s leading trade fairs for electronics and already offers more than 860 exhibitors for the 2021 event, which is co-located with SEMICON Europa. Isola, located at Productronica 2021 booth B3.226, will be represented by its European division, Isola GmbH.

Read more: Isola Shows Myriad of Materials at Productronica 2021 Exhibition

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Category: Press Releases

AUSTIN, Texas, Nov. 1, 2021 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member.

Read more: HDP User Group Announces Co-Tech Development Membership

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Category: Press Releases

Imaging Business Unit to upgrade its Electronic Design Environment with Zuken’s CR-8000 and DS-CR

Read more: Panasonic and Zuken Complete Agreement for Electronic Design Solution

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Category: Press Releases

CHENNAI: KLA Corporation, a solutions provider for the global semiconductor and chips industry, has opened two new facilities in Chennai to strengthen its research and talent development.

Read more: Tamil Nadu: KLA Corporation opens two new facilities in Chennai

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ATLANTA – ECIA has been tracking member responses to workplace disruptions caused by the pandemic by means of a survey conducted with industry company management during early Aug 2021 and again in late Sep 2021. ECIA’s Chief Analyst Dale Ford discusses the survey results in a webinar recording now available at 2021 Oct 19 Results from Survey on Business Operations Post-Covid on Vimeo.

Read more: ECIA Posts Workplace Survey Results Webinar Recording

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Category: Press Releases

Austin, Texas. October 18, 2021. High Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.

Read more: High Density Packaging User Group Announces Uyemura Membership

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