Schramberg / Munich - May 6, 2019 - Schweizer Electronic AG and Infineon Technologies have developed a new technology for mild hybrid vehicles: the chip embedding of power MOSFETs. The technology significantly increases the performance of 48V systems while reducing their complexity.

Aspocomp Group Plc announced on April 3, 2019 a directed share issue without payment by which the company will issue 38,000 new shares to transfer the earned shares for 2018 according to the terms and conditions of the key employees’ Share Reward Plan.

01 May 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is delighted to announce the appointment of Sven Schnell as Technical Sales Engineer. Sven will support sales activities in Germany and Eastern Europe, specializing in Ventec's advanced IMS/Thermal Management solutions including a distributed range of Thermal Interface Materials (TIM) from EMI Thermal.

Nano Dimension can now shorten development times for IoT devices by up to 90% compared with traditional devices