BANNOCKBURN, Ill., USA, May 1, 2017 – John Mitchell, president and CEO of IPC – Association Connecting Electronics Industries, issued the following statement on the April 29 Executive Order by President Donald Trump, creating a new White House Office on Trade and Manufacturing Policy: 

Read more: IPC Welcomes New White House Office on Trade and Manufacturing Policy

Conductor Analysis Technologies (CAT) has announced the sale of two OM Thermal Stress Systems to TTM Technologies, Sterling Virginia. “This is a significant step in the adoption of reflow simulation for bare board acceptance by the industry,” said Tim Estes, Chief Technology Officer at CAT.

Read more: Conductor Analysis Technologies (CAT) Provides Test Systems to TTM Technologies

Leoben, 25 April 2017 – Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum voltages of +/- 400 V and currents of 5 A.

Read more: ECP Technology from AT&S Enables Evaluation of a Fully Integrated Multilevel Power Converter on...

Insulectro, the largest distributor of materials for use in printed circuit boards and printed electronics, has just added popular constructions of DuPont’s flexible laminates to its PumaFast stocking inventories.

Read more: Insulectro Adds DuPont Pyralux Laminates to Ready-to-Ship Pumafast Inventory Program