NESS ZIONA, Israel- June 27, 2017 - Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has received a grant approval from the Israel Innovation Authority, which will be used to finance a project to develop 3D printing of electronical modules for space applications.

Read more: Nano Dimension, in Collaboration with Harris Corporation, Receives Grant Approval to Develop 3D...

MILPITAS, CA -- Lenthor Engineering, a California based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards, has recently invested in a new Fuzion Platform from Universal.  The dual beam Fuzion 2-37 is a high performance multi-function solution that when added to Lenthor’s existing line will greatly boost production speed.

Read more: Lenthor Engineering Boosts Speed with Fuzion Platform from Universal

AURORA, COLORADO – Offshore PCB sourcing expert, Greg Papandrew, has been tapped as the Offshore Sales Director for Advanced Circuits’newly created offshore division.

Read more: Greg Papandrew to Lead Advanced Circuits' Offshore Division

MARLBOROUGH, MA--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE: DOW), announced that Business President James T. Fahey, Ph.D. will offer the afternoon keynote during the first-ever IMAPS System-in-Package (SiP) conference.

Read more: Dow Electronic Materials' James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference