ATLANTA – ECIA is pleased to announce the 2024 Executive Conference theme, ‘Navigating the Tides of Change.’ Conference Chair Ken Bellero expands on the concept. “As chairperson of this year’s ECIA executive conference, I am both humbled and exhilarated to stand at the helm as we Navigate the Tides of Change together. It is through our collective wisdom, resilience, and innovation that we will chart a course to thrive in the ever-evolving landscape of the electronics industry. Our plan this year is to push the boundaries of our comfort zones and dare to dream of a future where we not only survive but thrive in the face of change.”
“Each year the conference theme serves to guide the committee and stimulate our imaginations as we plan activities and select speakers,” continued Stephanie Tierney, ECIA Director of Marketing Communications and Member Engagement. “The committee agreed that we wanted to build off the momentum from last year’s ‘Making Waves, the Power of You’. This theme takes that idea one step further as the industry evolves to address current and future challenges.”
The ECIA Executive Conference is a senior management level conference for the electronics industry's leading companies - representing the entire supply chain. The date for the 2024 Executive Conference is October 20-22 at the Loews Chicago O'Hare Hotel. Registration is now open.
CAMBRIDGE, UK – Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
Some believe that printing sensors is key to meeting this demand. Using established printing methods, sensors capable of measuring pressure, force, touch, light, gas, temperature, and more can be manufactured in large areas at high volumes. While printed sensors have historically struggled to compete with conventional sensing solutions on cost alone, the tides are turning. Mass digitization demands greater, more seamless digital integration, and large-area printed sensors are positioned to empower the next generation of smart sensing solutions behind this.
Large Area: Printing sensors is the key to large area sensing
Mass digitization will see data captured across more surfaces, and large-area sensors naturally represent a solution to meet this need. Large-area sensors mapping surface interactions offer greater spatial information and enhanced data granularity than using single-point sensors alone. To obtain sufficiently large-area sensors, printing becomes somewhat necessary, offering production in vastly expanded dimensions than what is possible using subtractive manufacturing processes.
Large-area printed sensors are witnessing sustained growth in consumer electronics applications for mapping surface interactions. Major PC manufacturers have begun employing large-area printed force sensors within laptop trackpads, offering dynamic 3D touch functionality to enhance the user interface experience. Printed photodetectors are emerging within OLED display stacks to provide multi-touch fingerprint authentication with minimal impact on overall device thickness. Multi-touch authentication using printed photodetectors promises up to 700 million times greater security than current single-finger methods.
It is unsurprising that smartphone and laptop products represent strong routes to market for printed sensors. These devices contain pre-existing large-area user interfaces that easily benefit from the added functionality printed sensors offer. Crucially, the fast development times and bespoke nature of consumer electronic sensing requirements complement the capabilities of printed sensor technology providers, who are well suited to co-develop custom sensing solutions.
Multifunctionality: printed sensors offer hybrid functionality in a compact form factor
In many sensing applications, measuring more than one metric at a time is required. Take, for example, 3D touch laptop trackpads, where high-accuracy touch detection must be accompanied with force input recognition. Printing sensors as sheets allows different sensing layers to be stacked and combined with minimal impact on form factor or weight. Printed sensors, therefore, offer a relatively straightforward way of integrating multifunctional sensing into existing products.
Automotive sector interest is driving multifunctional printed sensor growth opportunities in applications such as the thermal management of electric vehicle batteries. Hybrid printed temperature sensors can detect cell hot spots, while pressure sensing layers monitor battery swelling indicative of cell failure. Moreover, printed sensors augmented with printed heater layers provide the additional means to address these measurements, offering a complete active thermal management solution. Deployment, charging and discharging optimizations all increase battery capacity and prolong lifetime, and could be worth up to US$3000 in savings per vehicle.
The automotive sector is immersed in a period of sustained technological redefinition, with electrification and autonomy meta-trends molding the future of mobility. So, too, are automotive sensing requirements evolving, which lead printed sensor growth opportunities for enabling multifunctional technology solutions. If key cost, weight, and energy efficiency thresholds are met, printed sensors have the potential to define future electric vehicle sensing requirements before battery chemistry and design convergence invites more standardized solutions.
Flexibility: Balancing form and function with flexible sensors
Rigid sensors and detectors are often poorly suited for applications that require conformal sensing across non-planar surfaces – for example, X-ray medical imaging where, ideally, detectors would conform to limbs. Printing sensors on flexible substrates, such as PET, polyurethane, or polyimide, offers a conformable sensing solution that non-printed sensors struggle to replicate. The variety of elastic, thermal, and even biodegradable properties available means that sensing solutions are highly customizable and easily tailored for end-use applications.
Emerging growth opportunities for flexible photodetectors target displacing incumbent sensing technologies that would clearly benefit from greater flexibility and non-planar measurement. One such example includes large-area photodetectors for X-ray imaging. Flexible X-ray sensors that conform to the body offer the potential to improve medical diagnosis, while in industrial applications, the ability to image in confined spaces promises more time-efficient non-destructive component testing.
Flexibility is only desirable in a handful of photodetection applications, with more promising prospects residing with printed sensor technologies such as force, strain, and temperature sensing. Yet, some flexible photodetectors show the rare potential to compete on cost with existing image sensing solutions, for example, in X-ray and SWIR detection. However, growth prospects for printed photodetectors displacing incumbent image sensors will be contingent on overcoming steep and well-defined performance criteria.
Conclusions and outlook
Previously, printed sensors’ inability to meet critical cost, performance, size, and reliability thresholds stymied penetration into key product markets. But with mass digitization driving the need to capture data across more and more surfaces, large-area sensing is quickly emerging as the higher-valued market differential for printed sensor technology.
Saturation in consumer electronics product markets is driving interest in large-area sensors that offer innovative new functionality, and printed sensor technology providers are well-positioned to keep pace with fast development cycles. Multifunctional and flexible printed sensors are also increasingly desirable for use in the medical and electric vehicle industries. While conventional sensors can individually achieve large-area sensing, multi-functionality, and flexible form factors, the most efficient way to combine all three is with printed sensors.
Looking forward, IDTechEx predicts that the printed sensor market will reach US$960M by 2034. The growth anticipated will be driven by new opportunities unlocked by flexible large area and multifunctional sensors in applications such as battery health management, biometric authentication on flexible displays, and even flexible X-ray medical and industrial imaging.
For more information on IDTechEx’s research on this topic, please see their report, “Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets”. Downloadable sample pages are available for this report.
WESTFORD, MA – Zuken USA, Inc., a leader in electrical and electronic design software, is excited to announce that the renowned drummer and motivational speaker, Mark Schulman, will be the keynote speaker at this year's Zuken Innovation World Americas (ZIW) conference, co-located with integrate24. Scheduled for September 17-19, 2024, in the vibrant city of Cleveland, Ohio, the conference aims to bring together the brightest minds in the PCB, Wire Harness, and Digital Engineering fields.
For 30 years, Mark Schulman has been a first-call drummer for world-class rock and pop artists. He was voted "Top 3 Pop-Rock Drummers" in the Modern Drummer Reader's Poll in 2014 and has played four record-breaking world tours with P!NK. Mark's resume is a "Who's Who" of international rock and roll royalty including acts such as Cher, Billy Idol, Foreigner, Sheryl Crow, Stevie Nicks, Beyoncé and many other world-class artists.
Great performers in business are called rockstars, but true rockstars can teach the business world a lot about leadership, teamwork, resilience, engagement, and performing at the highest levels. Schulman's ultra-high-energy presentation is where music, video, audience interaction, and the secrets of rockstar performance collide. He inspires audiences to hack the rockstar attitude embracing these five words– there are no small moments. Mark's keynote shows the audience how creating an attitude shift–and viewing what they're doing everyday as a performance–will literally change lives.
"This year's Zuken Innovation World Americas, co-located with integrate24, promises to be an exceptional gathering of minds and talents," said Bob Potock, Vice President of Marketing at Zuken USA, Inc. "Having Mark Schulman join us as the keynote speaker underscores our commitment to providing leading-edge technological education and insights while inspiring our attendees to achieve successes in their professional and personal lives."
The collaboration between ZIW and integrate24 highlights a unique opportunity for engineering professionals to explore the latest trends, technologies, and challenges in electrical and electronic design and integration, digital engineering, systems engineering, and model-based design. Attendees can expect a comprehensive agenda comprising seven concurrent learning tracks along with free product training and product certification. Also of note, the second annual World Championships of Systems Architecture and Modeling will take place during the event.
FREUDENSTADT, GERMANY – The SCHMID Group (Schmid), a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week. As a renowned innovator and technology partner, Schmid presented groundbreaking insights on solutions for substrate production including organic and glass substrates, as well as details around their embedded trace (ET) process.
In this dynamic session entitled “Solutions for Substrate Production”, Laurent Nicolet, Schmid Group’s Electronics Vice President, elaborated on the challenges facing traditional organic and next generation glass substrate production and how Schmid solves these problems for the industry.
Key Highlights:
Driven by increasing chiplet requirements for high-end performance applications, like AI, new substrate materials and technologies are needed to support miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems.
Schmid’s breakthrough ET process opens new design opportunities for next generation substrates that enable manufactures to produce the most advanced substrates below two microns on glass or organics.
Glass substrates, which exhibit superior thermal and dimensional properties, exceptional dielectric characteristics and capacity for increased chiplet integration, and greater COWOS design flexibility are possible with ET.
Offering more than 70% of processes and equipment needed, substrate manufacturers can collaborate with a single supplier for both equipment and process solutions to streamline their operations.
Christian Schmid, Schmid Group Chief Executive Officer, commented “Nicolet’s presentation at ISES USA examined how our proprietary ET process is at the intersection of next generation innovation, sustainability, and industry transformation alongside our customers. We are pleased with the feedback we received during the event and confident that these technologies will be integrated into future advanced packaging solutions worldwide”.
Schmid will be exhibiting at the IPC’s Apex/Expo in Annahiem, California, April 9-11, showcasing the latest equipment and process solutions for both UHDI and advanced substrates, including glass with capabilities down to 2 microns and below. See us at booth #4632.
CALUMET, MI – Calumet Electronics is proud to announce a significant expansion of its domestic printed circuit board (PCB) production capacity at its campus in Michigan’s Upper Peninsula. Over the last four years, Calumet has strategically invested in manufacturing equipment, workforce development, and campus expansion. These company-wide efforts aim to fulfill two strategic objectives: meeting the increased volume and technology demands of current and future clients and reinforcing Calumet’s commitment to onshoring critical advanced PCB production capabilities for DoD partners including flex and rigid flex boards. The company is currently building America’s most advanced substrate factory, slated to be operational later this year.
The recent investments by Calumet have focused on expanding its manufacturing campus to more than 200,000 square feet. This is the fourth expansion in the company’s history. Situated in the heart of a rural community, the growing campus is bustling with a highly trained workforce, additional engineers, refined processes, and state-of-the-art equipment. Moreover, Calumet’s investments extend beyond infrastructure and equipment. To support its expanded production, the company has made substantial investments in its people and culture, emphasizing SOP training to cultivate a team of top-tier producers.
Todd Brassard, Chief Operating Officer of Calumet, commented, “As we scale up our expanded production, we are seizing more opportunities to provide quotes. Depending on the complexity of the PCB design, domestically produced orders can ship in approximately three to five weeks. We are equipped to deliver standard work promptly and tackle the industry’s most complex challenges with our world-class team and cutting-edge facility, right here in the U.S.”
Calumet is one of the few American companies wholly committed to manufacturing PCBs domestically. While majority of domestic PCB production moved offshore over the past few decades, leaving only 4% of the world’s PCB manufacturing in the U.S., Calumet Electronics remains steadfast in its commitment to zero offshoring – both now and in the future.
In a landscape where other board shops are closing their doors, Calumet’s strategic plans have positioned the company as a leader in PCB and substrate manufacturing in the United States.
SINGAPORE – ENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems. While flexible printed circuits (FPC) are often employed in these systems, they are the most expensive component in the current collector assembly. ENNOVI’s flexible die-cut circuit (FDC) technology offers a more cost-effective and sustainable solution, with fewer manufacturing procedures and faster continuous reel-to-reel production.
Generally, FPCs are manufactured using a multi-stage, batch photolithography process to etch copper traces for the flexible circuit. This production process uses corrosive chemicals that dissolve the unwanted copper. In addition, it takes a lot of time and energy to extract the waste copper from the chemicals, making it challenging to effectively recycle. The die-cutting process allows for instant recycling of the copper, making it a more substance preference to chemical etching.
Compared with FPCs, which have a size limitation of 600x600mm, FDCs boast no length restrictions as they are manufactured reel-to-reel. Under certain design considerations, the FDC provides similar performance characteristics to FPCs. These results were confirmed through rigorous in-house dimension, thermal shock, trace resistance, temperature rise, insulation resistance and high voltage testing.
“Adopting the FDC capability for flexible circuits aligns with our vision to think outside the box in creating a sustainable battery value chain for EVs,” explains,” explains Gustavo Cibrian, at ENNOVI. “Our efforts enable ENNOVI to offer battery manufacturers a CCA design solution that balances their imperatives in terms of cost, time and performance. Allowing them to design to cost.”
For more information on ENNOVI’s FDC competency, please visit
