Press Releases

Partnership enhances Rogers' ability to service RF & low-loss PCB customers

Read more: Rogers Corporation's Advanced Connectivity Solutions Business Adds North American Distribution...

With the relocation due to his term as director and president ending, Taiyo America, Inc.’s Tadahiko Hanada has been transferred to the position of general manager, FPC Materials Department at Taiyo Ink Japan, effective May 1, 2019.

Read more: Taiyo America, Inc. Announces New President

Flex and rigid flex circuit board manufacturer, Printed Circuits has added to their drilling department with high speed, fully automatic drill/routers from Pluritec.

Read more: Printed Circuits Upgrades Drilling with Pluritec and Excellon

ARLINGTON, WA ― June 2019 ― CheckSum, a leading provider of test systems, fixtures and programs, wants the world to know that their Parallel Technology offers many advantages by testing in line as opposed to in a test cell, avoiding costly potential issues down the line.

Read more: CheckSum Parallel Technology Reduces Inventory Pile-Ups

ALBUQUERQUE, NEW MEXICO -- 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, announced today that it has secured an investment from aerospace and global security leader Lockheed Martin, as part of its Series B funding.

Read more: 3D Glass Solutions Secures Investment from Lockheed Martin Ventures

atg Luther & Maelzer GmbH (A COHU Company), is proud to announce the installation of its first extra-large format 24 test head flying probe system at the TTM Technologies Stafford Division.

Read more: atg's A7-24 Provides TTM Large Format Testing Capability

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