BANNOCKBURN, Ill., USA, September 5, 2019 — Today, IPC – Association Connecting Electronics Industries® announced Shawn DuBravac, Ph.D., CFA, will serve as the association’s chief economist. In this role, DuBravac will expand IPC’s research program and provide insights on the biggest issues facing the $2 trillion global electronics industry, including supply chain resiliency/uncertainty, trade wars, skilled workforce shortage, and the expanding role of electronics in the global economy.
NESS ZIONA, Israel – September 4, 2019 – Nano Dimension Ltd., a leading additive electronics provider (Nasdaq, TASE: NNDM), today announced that one of the one of the top ten largest U.S.-based global defense providers has bought a DragonFly system for additive manufacturing of electronics. Nano Dimension, a certified U.S. Department of Defense vendor with a CAGE code, helps defense companies meet strict timelines, produce fully functional electronic circuitry and protect their security-sensitive and proprietary designs.
“The Swedish Security and Defense Industry Association are pleased to welcome Elmatica as a new member,” Secretary-General, Robert Limmergård stated.
Chandler, AZ - Rogers Corporation (NYSE:ROG) is exhibiting at the upcoming PCB West show. The PCB West exhibition will be held on September 10th, 2019 at the Santa Clara Convention Center (Santa Clara, CA). Visitors will find plenty of the latest high-performance circuit materials from Rogers Corp. at booth 201.
BANNOCKBURN, Ill., USA, September 3, 2019 — IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
3 September 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials at two key industry trade shows in the US this month.