Press Releases

WASHINGTON, D.C. — Thomas J. Donohue, CEO, U.S. Chamber of Commerce issued the following statement in response to news that the administration and House Democrats have reached a handshake deal on the United States-Mexico-Canada Agreement (USMCA):

Read more: U.S. Chamber Statement on USMCA Handshake Deal

LYON, France - December 9, 2019 | “Our world is going digital. And this revolution will clearly impacts the printing technologies” says Gaël Giusti, PhD. Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole), “Emerging printing technologies are benefiting most from this move. They are now on the verge of replacing some conventional manufacturing techniques in the electronics, microelectronics and display industries”.

Read more: Emerging printing fills the gap for rising electronics applications

SANTA ANA, Calif., Dec. 02, 2019 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (TTMI), a leading global printed circuit board (“PCB”) products, radio frequency (“RF”) components and engineered solutions manufacturer, announced today that it will participate in the International Electronics Circuit Exhibition (Shenzhen) 2019, held from December 4 to 6 at the Shenzhen Convention and Exhibition Center in Shenzhen, China. Building upon the theme of “Inspiring Innovation”, TTM Technologies’ (TTM) technical experts will conduct a series of sessions to share views on important industry trends and the company’s latest innovative technologies to help customers successfully address these trends.  The sessions will cover a range of important topics for the markets TTM serves, including – “mSAP Technology-Enabled Substrate-Like-PCB (SLP) Application,” “PCB Design Trend and Challenge for Telecom and Networking”, “Technologies for mmWave Application – the Values TTM brings to the Development of Radar PCBs”.  TTM’s booth number for the event is 1L01.

Read more: TTM Technologies, Inc. to exhibit at the International Electronics Circuit Exhibition (Shenzhen)...

LYON, France - December 2, 2019 | “Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).

Read more: Automotive industry: vehicle autonomy & electrification are pushing the adoption of advanced...

BANNOCKBURN, Ill., USA, December 2, 2019 — IPC – Association Connecting Electronics Industries announces a leadership change within the IPC Education Foundation (IPCEF). At the end of the year, Colette Buscemi, senior director, IPCEF, will leave the Foundation and Charlene Gunter du Plessis, who currently serves as the Foundation’s director of strategic partnerships and programs, will transition into the role of senior director.

Read more: IPC Education Foundation Announces Change in Leadership

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Read more: International Electronics Circuit Exhibition (Shenzhen) Presents Technical Conference

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