(Waterbury, CT USA) – January 21, 2020 – MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA HiTech portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.

Read more: MacDermid Alpha Electronics Solutions to Highlight the Kester Integration at IPC APEX EXPO 2020 –...

Chandler, Arizona – Rogers Corporation (NYSE:ROG) will be exhibiting in booth #3802 at IPC APEX EXPO in San Diego, CA Feb. 4th-6th, highlighting some of its next generation high performance circuit materials. 

Read more: Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX Expo 2020

20 January 2020 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will feature its brand new and enhanced set of high-performance, high-reliability high-speed / low-loss / high-frequency materials at the upcoming DesignCon and IPC APEX Expos. The Ventec technology team will be in Santa Clara (CA) at DesignCon on Booth #205 and key company executives will be joined by the US-team at IPC APEX in San Diego (CA) on booth #4434.

Read more: Ventec’s High-Speed/Low-Loss/High-Frequency Material Technology Takes Center Stage at US-Expos

Printed circuit boards (PCBs) plays an important role in our day to day life.

Read more: CML manufactures Insulated Metal Substrate (IMS) solutions