AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.

Paul Cooke of AGC is presenting a professional development course “PD10: PCB design for High Reliability” on Sunday Mar. 16, 2025 at 1:30pm. Additionally, Kevin Bivona of AGC is presenting :Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features” on Wednesday, Mar. 19, 2025 at 3:30pm.

Visit us at Booth 3814 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series. Learn more at our website agc-mutlimaterial.com.

IPC APEX EXPO is the industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference and professional development courses.

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