Speaker Dale Lee, Plexus, to lead day-long instruction on DFX

BANNOCKBURN, Ill., USA, September 17, 2019 — IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.

Providing a comprehensive review of pitfalls that can occur in assembly and how they often have a direct link to design, the seminar will be led by instructor Dale Lee, senior staff DFX strategy engineer, Plexus Corporation.

Geared toward designers, manufacturing/process engineers, quality and reliability engineers, and managers or technicians involved in the design, fabrication, assembly or testing of printed board assemblies, attendees will learn:

• The effect of bare board choices on function and reliability of assembly
• How PCB design complexity impacts on fabrication costs and reliability
• Limitations of industry standards
• PCB design effects on assembly: thermal balance, trace routing, via interconnection, Z-axis TCE
• Impacts of component and PCB warpage/flatness on yields and reliability
• Impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage

“There is a direct connection between the design of a device and complications that may occur in the assembly process,” said Brook Sandy-Smith, IPC technical conference program manager. “This course will shine a light on those opportunities for improvement, taught by a distinguished expert in the field.”

For more information on Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) or to register, visit www.ipc.org/DfX-workshop.

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